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Change modules easily: tde presents unlocking tool for tML system platform

The company tde – trans data elektronik GmbH is expanding its tML portfolio with an unlocking tool. This release aid makes it even easier to change or dismantle modules in the tML system platform. It also significantly reduces assembly times when changing and removing modules. The innovative tool makes it easy to unlock and remove modules in the extendable module carrier. The result: even more flexibility and, in particular, even easier and faster handling and faster module installation when migrating to higher transmission rates and therefore more sustainability and future-proofing in the data centre.

Ready for high speed: tde at ANGA COM 2024

For the first time at ANGA COM, tde – trans data elektronik GmbH, internationally successful developer and manufacturer of scalable cabling systems and technology leader in multi-fibre technology, will be exhibiting the company’s portfolio for investment- and future-proof cabling systems. The focus is on solutions that meet the constantly growing demand for more and more bandwidth. One highlight is the innovative tML Reverse Module, which allows the same port density both in the rear area and in the patch area. Visitors to the booth can also experience the innovative plug-and-play cabling system tML 24+ with the compact MMC connector from US Conec and the modular Central Office solution tDF. ANGA COM will take place from 14 to 16 May in Cologne. tde invites visitors to be a guest at the tde booth. For mutual planning security, tde also allocates fixed appointments to interested trade fair visitors on request. More information can be found on the tde.de website.

tde presents tML Reverse Module

Dortmund/Germany, 25 April 2024. tde – trans data elektronik GmbH is adding a pioneering innovation to the tML system platform: with the new tML Reverse Module, the network specialist is the first manufacturer to offer a module that can be fitted on the platform in two directions. Meaning that patching is now also possible in the rear area. The same number of ports can be integrated at the front and rear with maximum packing density. The module is compatible with all standard connectors, including the new highly compact MDC connector.

tde is the first network expert in Europe to integrate the MMC connector from US Conec into its successful tML system platform, thereby doubling the packing density of its cabling systems.

First cabling platform with MMC connectors in the rear and patch area: tde presents tML 24+r

Dortmund, February 2, 2024. tde – trans data elektronik GmbH continues to drive forward its technological leadership in the modular cabling system field for maximum packing efficiency, investment security and simple migration currently up to 800 G and more: tde is the first network expert in Europe to integrate the MMC connector from US Conec into its successful tML system platform, thereby doubling the packing density of its cabling systems. Simultaneously, tde is presenting the new tML24+, an innovative solution based on the integration of the highly compact 24-fiber MMC multi-fiber connector in the rear area. tde also provides tML modules with MMC for the patch area: One module accommodates 24 MMC adapters at the front, each with 12, 16 or 24-fiber MMC connectors and therefore up to 4,608 fibers modularly on one height unit. Thanks to its APC angle-polished convex surface, even in the multimode version, the MMC offers improved performance in terms of insertion loss and return loss. Customers benefit from migration and investment-proof high-density applications currently up to 800 G and higher.

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